Tech Scouting Semiconductor Packaging
A leader in the chip packaging market requested that the IP portfolio be assessed against other market challengers to ascertain their research plans. The study offered comprehensive information regarding competitors and highlighted the advantages and segments that required enhancements. It also estimated the future R&D required for better performance. Client Background: The client is a […]
Next-Generation Lithography: An Efficient Choice for Fabrication
Next-generation lithography (NGL) refers to techniques that use short-wavelength lights to help achieve finer resolution features from existing light wavelengths. The need for NGL stems from the drive towards chip sizes of 5nm and beyond. There are many potential candidates of NGL, like Extreme Ultraviolet (EUV) lithography, x-ray lithography, electron beam lithography, focused ion beam […]